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sdfs093 ? november 1992 ? revised december 1993 copyright ? 1993, texas instruments incorporated 2?1 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 ? designed to reduce reflection noise ? repetitive peak forward current . . . 300 ma ? 16-bit array structure suited for bus-oriented systems description this bus-termination array is designed to reduce reflection noise and minimize ringing on high-performance bus lines. the SN74F1016 features a 16-bit r-c network and schottky barrier diode array. these schottky diodes provide clamp-to-ground functionality and serve to minimize overshoot and undershoot of high-speed switching buses. the SN74F1016 is characterized for operation from 0 c to 70 c. schematic diagram 20 19 18 17 16 15 14 13 12 11 12 3 4 5 6 7 8 910 gnd a16 a15 a14 a13 a12 a11 a10 a9 gnd gnd a1 a2 a3 a4 a5 a6 a7 a8 gnd resistor = 50 ? 10% capacitor = 47 pf 10%, v r = 2.5 v, f = 1 mhz diode = schottky dw package (top view) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 gnd a1 a2 a3 a4 a5 a6 a7 a8 gnd gnd a16 a15 a14 a13 a12 a11 a10 a9 gnd
sdfs093 ? november 1992 ? revised december 1993 2?2 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? steady-state reverse voltage, v r 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous forward current, i f : any d terminal from gnd 50 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . total through all gnd terminals 170 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . repetitive peak forward current, i frm ? : any d terminal from gnd 300 ma . . . . . . . . . . . . . . . . . . . . . . . . . . . . total through all gnd terminals 1.2 a . . . . . . . . . . . . . . . . . . . . . . . . . continuous total power dissipation at (or below) 25 c free-air temperature 500 mw . . . . . . . . . . . . . . . . . . . . operating free-air temperature range 0 c to 70 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only an d functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. ? these values apply for t w 100 s, duty cycle 20%. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) single-diode operation (see note 1) parameter test conditions min typ ? max unit i r static reverse current v r = 7 v 2 a v fm peak forward voltage i f = 200 ma 1.25 v v r = 0 80 c t total capacitance v r = 2 v 60 pf c t total capacitance v r = 3 v 55 pf ? all typical values are at t a = 25 c. note 1: test conditions and limits apply separately to each of the diodes. the diodes not under test are open-circuited during the measureme nt of these characteristics. multiple-diode operation parameter test conditions min typ ? max unit i x internal crosstalk current total gnd current = 1.2 a, see note 2 10 50 a note 2: i x is measured under the following conditions with one diode static, all others switching: switching diodes: t w = 100 s, duty cycle = 20%; static diode: v r = 5 v; the static diode input current is the internal crosstalk current i x . switching characteristics, t a = 25 c parameter test conditions min typ ? max unit t rr reverse recovery time i f = 10 ma, i rm(rec) = 10 ma, i r(rec) = 1 ma, r l = 100 ? 8 10 ns undershoot characteristics parameter test conditions min typ ? max unit v us undershoot voltage t f = 2 ns, t w = 50 ns, v ih = 5 v, v il = 0, z s = 25 ? , z o = 50 ? , l = 36-inch coaxial cable 0.7 0.8 v
sdfs093 ? november 1992 ? revised december 1993 2?3 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 application information large negative transients occurring at the inputs of memory devices (drams, srams, eproms, etc.) or on the clock lines of many clocked devices can result in improper operation of the devices. the SN74F1016 diode termination array helps suppress negative transients caused by transmission line reflections, crosstalk, and switching noise. diode terminations have several advantages when compared to resistor termination schemes. split resistor or thevenin equivalent termination can cause a substantial increase in power consumption. the use of a single resistor to ground to terminate a line usually results in degradation of the output high level, resulting in reduced noise immunity. series damping resistors placed on the outputs of the driver will reduce negative transients, but they can also increase propagation delays down the line, as a series resistor reduces the output drive capability of the driving device. diode terminations have none of these drawbacks. the operation of the diode arrays in reducing negative transients is explained in figure 1. the diode conducts current whenever the voltage reaches a negative value large enough for the diode to turn on. suppression of negative transients is tracked by the current-voltage characteristic curve for that diode. a typical current voltage for the SN74F1016 is shown in figure 1. the maximum effectiveness of the diode arrays in suppressing negative transients occurs when they are placed at the end of a line and/or the end of a long stub branching off a main transmission line. the diodes can also be used to reduce the negative transients that occur due to discontinuities in the middle of a line. an example of this is a slot in a backplane that is provided for an add-on card. 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ? forward current ? ma v f ? forward voltage ? v t a = 25 c i i variable 1: v in ?ch1 linear sweep: start 0.000 v stop ?2.000 v step ? 0.010 v constants: v hi ?vs1 3.5000 v v lo ?vs2 0.0000 v ?100 ?90 ?80 ?70 ?60 ?50 ?40 ?30 ?20 ?10 0 diode forward current vs diode forward voltage figure 1
sdfs093 ? november 1992 ? revised december 1993 2?4 post office box 655303 ? dallas, texas 75265 post office box 1443 ? houston, texas 77251?1443 z o = 50 ? length = 36 in (a) undershoot test setup z s = 25 ? 218.500 ns ch. 1 = 1.00 v/div timebase = 5.00 ns/div vmarker 1 = 0.00 v vmarker 2 = ?640.00 mv offset = ? 20.00 mv delay = 243.5 ns delta v = ?640.00 mv 243.500 ns 268.500 ns vmarker 1 (b) scope display s1 s1 open s1 closed vmarker 2 ?2.0 v figure 2. undershoot test setup and scope display
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim SN74F1016dwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti package option addendum www.ti.com 10-may-2007 addendum-page 1
to customer on an annual basis. package option addendum www.ti.com 10-may-2007 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 q1 package materials information www.ti.com 11-mar-2008 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 346.0 346.0 41.0 package materials information www.ti.com 11-mar-2008 pack materials-page 2

package option addendum www.ti.com 10-jun-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples SN74F1016dw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f1016 SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f1016 SN74F1016dwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f1016 SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f1016 SN74F1016dwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 0 to 70 f1016 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device.
package option addendum www.ti.com 10-jun-2014 addendum-page 2 (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant SN74F1016dwr soic dw 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 q1 package materials information www.ti.com 3-jan-2013 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) SN74F1016dwr soic dw 20 2000 367.0 367.0 45.0 package materials information www.ti.com 3-jan-2013 pack materials-page 2
www.ti.com package outline c typ 10.63 9.97 2.65 max 18x 1.27 20x 0.51 0.31 2x 11.43 typ 0.33 0.10 0 - 8 0.3 0.1 0.25 gage plane 1.27 0.40 a note 3 13.0 12.6 b 7.6 7.4 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic notes: 1. all linear dimensions are in millimeters. dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.43 mm per side. 5. reference jedec registration ms-013. 1 20 0.25 c a b 11 10 pin 1 id area note 4 seating plane 0.1 c see detail a detail a typical scale 1.200
www.ti.com example board layout (9.3) 0.07 max all around 0.07 min all around 20x (2) 20x (0.6) 18x (1.27) (r ) typ 0.05 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic symm symm land pattern example scale:6x 1 10 11 20 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. metal solder mask opening non solder mask defined solder mask details solder mask opening metal under solder mask solder mask defined
www.ti.com example stencil design (9.3) 18x (1.27) 20x (0.6) 20x (2) 4220724/a 05/2016 soic - 2.65 mm max height dw0020a soic notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. symm symm 1 10 11 20 solder paste example based on 0.125 mm thick stencil scale:6x
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